Principle Engineer, SSD Firmware Engineering@ SanDisk

Job Information

Job Description:

  • Perform failure analysis in finished or semi-finished failed product in drive, package or device level.
  • Define FA flow for each FA case.
  • Generate FA report and assist process engineer for root causing of defect/s.
  • Maintain the FA dashboard and FA equipment in good condition.
  • Develop the FA process and FA capability for new product and new technologies node.
  • Innovate new FA methodology to improve TAT and FA accuracy.

Qualifications

  • Bachelor Degree and/or Master in Electrical/ Electronic, Microelectronic Engineering or Material Engineering with minimum 5 years in failure analysis.
  • Familiar with SSD system, IC package and device analysis methodology
  • Familiar with semiconductor and SMT assembly process and technology
  • Familiar with memory product technology and structure
  • Understand memory product test process and methodology
  • Skillful in performing failure analysis with FA tools or methodology such as 3D X-ray, CSAM, SEM/EDX, chemical decapsulation, TDR, curve tracer analysis, optical microscopes, hot spot analysis.
  • Strong memory IC de-processing skills
  • Good communication and presentation skills
  • Good teamwork spirit and growth mindset
  • Fluent in English speaking, reading and technical FA report writing
  • Previous electrical FA experience in IC or memory devices is preferred

Benefits:
Experience Level: Senior
Work From: Onsite

Company Information

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